AHSM7394S

Description

AHSM7394S is world's leading WiFi HaLow™ stamp type solder down module

The AHSM7394S allows building long range, ultra-low power WiFi networks in sub 1 GHz license-exempt bands, utilizing compact form factor.
The AHSM7394S data rate up to 15 Mbps which better than LoRa 38.4 Kbps with the high-speed data rate, it enables connectivity for many IoT applications, including sensors, weather stations, industrial monitoring, medical patient monitoring, agriculture monitoring, surveillance camera.

Key Features

NEWRACOM NRC7394 HaLow chipset
Up to 15Mbps data rate
HaLow IPEX/U.FL antenna connector
SPI and UART support for host interface
Stamp type soldering hole

Specifications

Hardware Genera

Chipset	NEWRACOM NRC7394
Frequency	915 MHz (US) 868 MHz (EU) 924 MHz (JP)
Modulation	OFDM with BPSK, QPSK, 16QAM, 64QAM
Date rate	Up to 15 Mbps (Max. Phy rate)
Channel bandwidth	1/2/4 MHz (US) 1 MHz (EU) 1/2/4 MHz (JP)
Antenna connector	HaLow IPEX/U.FL antenna connector
Host interface	SPI, UART
Form facto	Stamp type solder down module
Dimensions	21.8(L) × 19.3(W) x 2.8(H) mm (Includes shielding case)
Operating temperature	-40°C to +85°C (-40°F to 185°F)
Software & SDK	https://github.com/newracom

Order Information

AHSM7394S-915 (US)	902 MHz – 928 MHz	26 MHz
AHSM7394S-868 (EU)	863 MHz – 868 MHz	5 MHz
AHSM7394S-924 (JP)	920.5 – 927.5 MHz	7 MHz

Pciifin Dcaetifioninstion - Pin Map

Pin Definition - Pin Description

Pin No.	Definition	Description	Voltage	Type
1	TXD1	UART1_TXD (UART channel1 Tx data)		O
2	RXD1	UART1_RXD (UART channel1 Rx data )		I
3	CTS1	UART1_CTS (UART channel1 clear to send)		I
4	RTS1	UART1_RTS (UART channel1 request to send )		O
5	MODE	Boot mode (0: ROM boot, 1: XIP boot)		I
6	GND	GROUND		GND
7	GND	GROUND		GND
8	GND	GROUND		GND
9	ADC0	Auxiliary ADC channel 0		I
10	ADC1	Auxiliary ADC channel 1		I
11	GP24	General purpose I/O		I/O
12	GP25	General purpose I/O		I/O
13	GND	GROUND		GND
14	VDDIO	VDD_IO (NRC7394 I/O power input)	1.8V-3.3V	Power
15	GND	GROUND		GND
16	GND	GROUND		GND
17	VBAT (V33)	VBAT (NRC7394 PMS, RF/PA power input)	3.3V	Power
18	GND	GROUND		GND
19	POR_B	NRC7394 reset input (active low) POR reset output (internal pull-up)		I/O
20	CS_B	Host SPI – chip select (active low)		I
21	MISO	Host SPI – master in slave out		O
22	MOSI	Host SPI – master out slave in		I
23	SCLK	Host SPI – clock		I
24	EIRQ	Host SPI – interrupt (active high)		O
25	TXD0	UART0_TXD (UART channel0 Tx data)		O
26	RXD0	UART0_RXD (UART channel0 Rx data )		I
27	GP10	General purpose I/O		I/O
28	GP11	General purpose I/O		I/O
	G1, G2, G3, G4, G5	GROUND		GND

Operation Conduction & Current Consumption

◎ Operating condition

Symbol		Min	Typ	Max	Unit
Operating temperature range		-40	-	+85	°C
Operating voltage	VBAT	2.7	3.3	3.6	V
Operating voltage	VDDIO	1.68	3.3	3.6	V
Operating current (peak) Tx @16dBm	VBAT	250			mA
Operating current (peak) Tx @16dBm	VDDIO	2			mA

◎ Current consumption (Average)

MODE	DUT Status	VDDIO (mA)	VBAT(V33) (mA)
802.11ah (1/2/4MHz BW)	Tx @ 0 dBm	0.5	105.2
	Tx @ 10 dBm	0.5	169.2
	Tx @ 15 dBm	0.5	184.4
	Continuous Rx @ -85 dBm	0.4	21
	Deep sleep mode	0.08uA	3.2uA

√ Note: Unless otherwise specified, TA.=25℃, VBAT= 3.3V, 99% tx burst time, MCS0

√ Deep sleep : all clocks are gated, 32M & 32K Xtals off, all power off(except ALON), retention memory off.

√ HSPI pins to host are disconnected.

√ All GPIOs except for UART0 are connected to GND during VDDIO measurement.

◎ Thermal characteristics (NRC7394 IC Package)

Symbol	Description	Performance
Symbol	Description	Typ	Unit
TJ	Maximum junction temperature	125	°C
ΘJA	Thermal-resistance junction to ambient	30.53	°C/W
ΘJC	Thermal-resistance junction to case	3.8	°C/W

RF Specifications

AHSM7394S Tx transmit power / Rx receive sensitivity
Data Rate	Modulation	BW=1M			BW=2M			BW=4M			BW=8M
Data Rate	Modulation	Tx (dBm) +/-2	Rx (dBm)	IEEE spec.	Tx (dBm) +/-2	Rx (dBm)	IEEE spec.	Tx (dBm) +/-2	Rx (dBm)	IEEE spec.	Tx (dBm) +/-2	Rx (dBm)	IEEE spec.
MCS0	BPSK	17	-100	-95	17	-98	-92	17	-95	-89	N/A	N/A	-86
MCS1	QPSK	17	-99	-92	17	-95	-89	17	N/A	-86	N/A	N/A	-83
MCS2	QPSK	17	-97	-90	17	-93	-87	17	N/A	-84	N/A	N/A	-81
MCS3	16-QAM	17	-93	-87	17	-89	-84	17	N/A	-81	N/A	-N/A	-78
MCS4	16-QAM	16	-90	-83	16	-86	-80	16	-83	-77	N/A	-N/A	-74
MCS5	64-QAM	15	-86	-79	15	-82	-76	15	N/A	-73	N/A	N/A	-70
MCS6	64-QAM	14	-84	-78	14	-80	-75	14	N/A	-72	N/A	N/A	-69
MCS7	64-QAM	11	-82	-77	11	-79	-74	12	-76	-71	N/A	N/A	-68

Mode Pin Setting

MODE pin is provided for boot mode selection to offer flexible and configurable boot options as shown in Table M1.
In the case of XIP boot, it is necessary to change to XIP boot mode after FW upload, so users need to install a switch that can control the mode pins on the board.

MODE pin	Description
VDD	XIP boot mode (Standalone mode) F/W should be downloaded in external flash memory before power-up. The start address for boot is remapped to the start address of flash memory.
GND	ROM boot mode (Host mode) Boot from internal ROM code and wait for external command via HSPI or UART. The start address for boot is remapped to the start address of ROM memory.
GND	FW upload mode Firmware upgrade to external flash memory or upload to internal SRAM via UART0

Table M1: MODE description

Reference Design – UART (Standalone mode)

HSPI and UART1 are the general interfaces used for external host MCU. The HSPI is a specially designed SPI for high-speed data transfer.
UART0 is used for uploading test firmware or monitoring the firmware logs.

Reference Design – HSPI (Host mode)

HSPI and UART1 are the general interfaces used for external host MCU. The HSPI is a specially designed SPI for high-speed data transfer.
UART0 is used for uploading test firmware or monitoring the firmware logs.

Mechanical Information

Reflow Soldering Profile

Handling and Storage

The AHSM7394S class of modules are a moisture-sensitive device rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20.
After opening the moisture-sealed storage bag, modules that will be subjected to reflow solder or other high-temperature processes mustbe:
1.Mounted to a circuit board within 168 hours at factory conditions.
(≤30°Cand<60%RH)
OR
2.Continuously stored per IPC/JEDEC J-STD-033
Modules that have been exposed to moisture and environmental conditions exceeding packaging and storage conditions MUST be baked before mounting according to IPC/JEDEC J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage to modules during solder reflow.

Specifications

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